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Plaskon SMT-B-1NLV - Cookson Electronics - Semiconductor Products -

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Plaskon SMT-B-1NLV by Cookson Electronics - Semiconductor Products is a Epoxy (Epoxy; Epoxide) plastic material.

General Information

Product Description

This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.

General

Material Status

Commercial: Active

Availability

North America

Test Standards Available

ASTM

Features

Fast Cure

Good Dimensional Stability

Low Viscosity

Low Warpage

Semi Conductive

Forms

Liquid

Processing Method

Resin Transfer Molding

Other Information for this Plastic
How to Access the Full Plastic Material Data Sheet for this Grade
The information presented on this page is just a summary for this plastic material. The full plastic data sheet containing additional general information, technical properties, and processing specifications is available from IDES. Click here to register for free access. After registering, you'll have immediate access to more than 77823 full plastic material data sheets from 698 global resin suppliers.
Features (Alternate Representations)
Low Warpage, Low Warp, Good Dimensional Stability, Dimensionally Stable, Fast Cure, Fast Curing, Low Viscosity, Semi-Conductive, Semi Conductive.
Spelling Variations
The terms listed below may be used to identify this product. They are provided to assist you in finding pertinent documentation from supplier and non-supplier sources. They are included for informational purposes only, and are typically NOT representations that have been specified by the supplier. Possible spelling variations for terms related to this product are: Plaskon SMTB1NLV, PlaskonSMTB1NLV, Plaskon , SMTB1NLV, SMT:B:1NLV, SMT/B/1NLV, SMT+B+1NLV, SMT_B_1NLV, SMT B 1NLV, SMT-B-1 NLV, SMT-B-1NLV, NLVSMT-B-1, SMT, Epoxy; Epoxide, Epoxy Epoxide, EpoxyEpoxide, Epoxy, Cookson

The information presented on this plastic material data sheet was acquired by IDES from various sources, including the manufacturer of the resin and recognized testing agencies. In some cases, plastic material updates have been integrated directly into the IDES Plastics Database by the resin manufacturer utilizing the IDES Data Maintenance Tool. IDES makes substantial efforts to assure the accuracy of this plastics data. However, IDES assumes no responsibility for the data values and urges that upon final plastic material selection, data points are validated with the resin manufacturer.

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