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Plaskon SMT-B-2FPI - Cookson Electronics - Semiconductor Products -

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Plaskon SMT-B-2FPI by Cookson Electronics - Semiconductor Products is a Epoxy (Epoxy; Epoxide) plastic material.

General Information

Product Description

This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures.

General

Material Status

Commercial: Active

Availability

North America

Test Standards Available

ASTM

Features

Fast Cure

Good Moldability

High Heat Resistance

Low (to None) Lead Content

Low Moisture Absorption

Semi Conductive

Forms

Liquid

Processing Method

Resin Transfer Molding

Other Information for this Plastic
How to Access the Full Plastic Material Data Sheet for this Grade
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Features (Alternate Representations)
Low Moisture Absorption, Low Water Absorption, Water Resistant, Moisture Resistant, Low Lead Content, Good Moldability, Fast Cure, Fast Curing, High Heat Resistance, Semi-Conductive, Semi Conductive.
Spelling Variations
The terms listed below may be used to identify this product. They are provided to assist you in finding pertinent documentation from supplier and non-supplier sources. They are included for informational purposes only, and are typically NOT representations that have been specified by the supplier. Possible spelling variations for terms related to this product are: Plaskon SMTB2FPI, PlaskonSMTB2FPI, Plaskon , SMTB2FPI, SMT:B:2FPI, SMT/B/2FPI, SMT+B+2FPI, SMT_B_2FPI, SMT B 2FPI, SMT-B-2 FPI, SMT-B-2FPI, FPISMT-B-2, SMT, Epoxy; Epoxide, Epoxy Epoxide, EpoxyEpoxide, Epoxy, Cookson

The information presented on this plastic material data sheet was acquired by IDES from various sources, including the manufacturer of the resin and recognized testing agencies. In some cases, plastic material updates have been integrated directly into the IDES Plastics Database by the resin manufacturer utilizing the IDES Data Maintenance Tool. IDES makes substantial efforts to assure the accuracy of this plastics data. However, IDES assumes no responsibility for the data values and urges that upon final plastic material selection, data points are validated with the resin manufacturer.

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