Home > Plastics > Plaskon > Plaskon MUF-LFG

Plaskon MUF-LFG - Cookson Electronics - Semiconductor Products -

Please login or register to view the full datasheet.

Plaskon MUF-LFG by Cookson Electronics - Semiconductor Products is a Epoxy (Epoxy; Epoxide) plastic material.

General Information
Product Description
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.
General
Material Status	Commercial: Active
Availability	North America
Test Standards Available	ASTM
Features	Good Processability Low Warpage Semi Conductive
Forms	Liquid
Processing Method	Resin Transfer Molding

Other Information for this Plastic
How to Access the Full Plastic Material Data Sheet for this Grade
The information presented on this page is just a summary for this plastic material. The full plastic data sheet containing additional general information, technical properties, and processing specifications is available from IDES. Click here to register for free access. After registering, you'll have immediate access to more than 77823 full plastic material data sheets from 698 global resin suppliers.
Features (Alternate Representations)
Semi-Conductive, Semi Conductive, Low Warpage, Low Warp, Good Processability, Easy Processing.
Spelling Variations
The terms listed below may be used to identify this product. They are provided to assist you in finding pertinent documentation from supplier and non-supplier sources. They are included for informational purposes only, and are typically NOT representations that have been specified by the supplier. Possible spelling variations for terms related to this product are: Plaskon MUFLFG, PlaskonMUFLFG, Plaskon , MUFLFG, MUF:LFG, MUF/LFG, MUF+LFG, MUF_LFG, MUF LFG, MUF, Epoxy; Epoxide, Epoxy Epoxide, EpoxyEpoxide, Epoxy, Cookson

The information presented on this plastic material data sheet was acquired by IDES from various sources, including the manufacturer of the resin and recognized testing agencies. In some cases, plastic material updates have been integrated directly into the IDES Plastics Database by the resin manufacturer utilizing the IDES Data Maintenance Tool. IDES makes substantial efforts to assure the accuracy of this plastics data. However, IDES assumes no responsibility for the data values and urges that upon final plastic material selection, data points are validated with the resin manufacturer.

IDES Home - Advertising Programs - Business Solutions - Order Online - About IDES - Contact IDES : 800-788-4668 | 307-742-9227

	Home Plastics Generics Manufacturers Distributors Store	Don't have an IDES account? Create an account now
	Tips