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Post Shrinkage, ISO 2577, Compression molding, Flow, 168h, 110°C: 0.55% Molding Shrinkage, ISO 2577, Flow, Compression molding: 0.4% Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <50h²: 160°C Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <20000h²: 130°C Proof Track Index, IEC 60112/ DIN IEC 112, Test liquid A: 125 PTI Water Absorption, ISO 62, 24h/23°C: 100 mg
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Product names can be difficult to match. You may have searched any one of these terms to find this product: Bakelite® PF 51, Bakelite PF 51, Bakelite® , Bakelite, BakelitePF51, PF 51, PF51, Phenol Formaldehyde Resin, PF, Phenolic, Hexion GmbH, PhenolFormaldehydeResin, 51PF
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