|
Post Shrinkage, ISO 2577, Injection molding, Flow, 168h, 110°C: 0.6% Post Shrinkage, ISO 2577, Compression molding, Flow, 168h, 110°C: 0.2% Molding Shrinkage, ISO 2577, Flow, Injection molding: 0.85% Molding Shrinkage, ISO 2577, Flow, Compression molding: 0.35% Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <50h²: 160°C Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <20000h²: 130°C Proof Track Index, IEC 60112/ DIN IEC 112, Test liquid A: 125 PTI Arc Resistance, ASTM D495: <60 sec Water Absorption, ISO 62, 24h/23°C: 50 mg
|
|
Product names can be difficult to match. You may have searched any one of these terms to find this product: Bakelite® PF 85, Bakelite PF 85, Bakelite® , Bakelite, BakelitePF85, PF 85, PF85, Phenol Formaldehyde Resin, PF, Phenolic, Hexion GmbH, PhenolFormaldehydeResin, 85PF
|