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Density
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g/cm³
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ISO 1183 |
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Apparent Density
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g/cm³
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ISO 60 |
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Molding Shrinkage - Flow
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%
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ISO 294-4 |
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Tensile Modulus
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psi
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ISO 527-2/1 |
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Tensile Stress (Yield)
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psi
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ISO 527-2/5 |
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Flexural Modulus
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psi
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ISO 178 |
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Flexural Strength 2
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psi
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ISO 178 |
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Compressive Stress - Flow
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psi
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ISO 604 |
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Charpy Notched Impact Strength (73°F)
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ft·lb/in²
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ISO 179/2eA |
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Charpy Unnotched Impact Strength (73°F)
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ft·lb/in²
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ISO 179/2eU |
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Ball Indentation Hardness (H 961/30)
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psi
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ISO 2039-1 |
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Heat Deflection Temperature (1160 psi, Unannealed)
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°F
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ISO 75-2/C |
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Surface Resistivity
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ohms
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IEC 60093 |
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Volume Resistivity
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ohm·cm
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IEC 60093 |
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Relative Permittivity (100 Hz)
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IEC 60250 |
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Dissipation Factor (100 Hz)
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IEC 60250 |
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Arc Resistance
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sec
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ASTM D495 |
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Arc Resistance (PLC)
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ASTM D495 |
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Electric Strength (0.0394 in)
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V/mil
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IEC 60243-1 |
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Flame Rating - UL
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UL 94 |
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0.0591 in, Black & Natural
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0.0591 in, All colors
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Post Shrinkage, ISO 2577, Injection molding, Flow, 168h, 110°C: 0.4%
Molding Shrinkage, ISO 2577, Flow, Injection molding: 0.7%
Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <50h²: 230°C
Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <20000h²: 150°C
Proof Track Index, IEC 60112/ DIN IEC 112, Test liquid A: 125 PTI
Arc Resistance, ASTM D495: 125 to 130 sec
Water Absorption, ISO 62, 24h/23°C: 20 mg
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Product names can be difficult to match. You may have searched any one of these terms to find this product: Bakelite® PF 2560, Bakelite PF 2560, Bakelite® , Bakelite, BakelitePF2560, PF 2560, PF2560, Phenol Formaldehyde Resin, PF, Phenolic, Hexion GmbH, PhenolFormaldehydeResin, 2560PF
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Features may also be described by the following terms: Good Surface Finish.
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Uses may also be described by the following terms: Semiconductor Protective Coatings, Semiconductor Protective Coating.
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