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Post Shrinkage, ISO 2577, Injection molding, Flow, 168h, 110°C: 0.25% Post Shrinkage, ISO 2577, Compression molding, Flow, 168h, 110°C: 0.15% Molding Shrinkage, ISO 2577, Flow, Injection molding: 0.5% Molding Shrinkage, ISO 2577, Flow, Compression molding: 0.2% Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <50h²: 230°C Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <20000h²: 170°C Proof Track Index, IEC 60112/ DIN IEC 112, Test liquid A: 175 PTI Arc Resistance, ASTM D495: 130 to 135 sec Water Absorption, ISO 62, 24h/23°C: 25 mg
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Product names can be difficult to match. You may have searched any one of these terms to find this product: Bakelite® PF 2874, Bakelite PF 2874, Bakelite® , Bakelite, BakelitePF2874, PF 2874, PF2874, Phenol Formaldehyde Resin, PF, Phenolic, Hexion GmbH, PhenolFormaldehydeResin, 2874PF
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Features may also be described by the following terms: High Strength, Good Electrical Properties, Good Dimensional Stability, Dimensionally Stable, Low Shrinkage.
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