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Post Shrinkage, ISO 2577, Injection molding, Flow, 168h, 110°C: 0.1% Post Shrinkage, ISO 2577, Compression molding, Flow, 168h, 110°C: 0.05% Molding Shrinkage, ISO 2577, Flow, Injection molding: 0.15% Molding Shrinkage, ISO 2577, Flow, Compression molding: 0.05% Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <50h²: 240°C Maximum Application Temperature, IEC 60216-P1/ DIN IEC 216-T1, <20000h²: 170°C Proof Track Index, IEC 60112/ DIN IEC 112, Test liquid A: 175 PTI Water Absorption, ISO 62, 24h/23°C: 13 mg
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Product names can be difficult to match. You may have searched any one of these terms to find this product: Bakelite® PF 4155, Bakelite PF 4155, Bakelite® , Bakelite, BakelitePF4155, PF 4155, PF4155, Phenol Formaldehyde Resin, PF, Phenolic, Hexion GmbH, PhenolFormaldehydeResin, 4155PF
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Features may also be described by the following terms: High Heat Resistance, Good Electrical Properties, Good Dimensional Stability, Dimensionally Stable, Low Shrinkage, High Strength.
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