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Hipec 643

Thermoset, Unspecified

Supplied by Dow Corning Corporation

The technical datasheet with complete property values for Hipec 643 is available to members of the Prospector Plastics Database.
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General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Features 
  • High Rigidity
Uses 
  • Semiconductor Protective Coatings
Appearance 
  • Tan
Forms 
  • Pellets
Physical
Nominal Value
Unit
Test Method
Apparent Density
g/cm³
 ASTM D1895
Water Absorption (24 hr)
%
 ASTM D570
Thermal
Nominal Value
Unit
Test Method
CLTE - Flow
in/in/°F
 ASTM D696
Thermal Conductivity
Btu·in/hr/ft²/°F
 ASTM C177
Electrical
Nominal Value
Unit
Test Method
Volume Resistivity
ohm·cm
 ASTM D257
Dielectric Strength
V/mil
 ASTM D149
Dielectric Constant
     ASTM D150
1 kHz
 
  
1 MHz
 
  
Dissipation Factor
     ASTM D150
1 kHz
 
  
1 MHz
 
  
Thermoset
Nominal Value
Unit
Test Method
Shelf Life
wk
  
Thermoset Mix Viscosity (77°F)
cP
 ASTM D2393
Related Terminology
Product names can be difficult to match. You may have searched any one of these terms to find this product: Hipec 643, Hipec , Hipec643, 643, Thermoset, Unspecified, Thermoset Unspecified, TS, Unspecified, TS Unspecified, Thermoset, TS, Dow Corning, ThermosetUnspecified, TSUnspecified
Features
Features may also be described by the following terms: High Rigidity.
Uses
Uses may also be described by the following terms: Semiconductor Protective Coatings, Semiconductor Protective Coating.
Notes
1Typical properties: these are not to be construed as specifications.
 
IDES
Copyright © 2012 IDES
The information presented on this datasheet was acquired by IDES from the producer of the material. IDES makes substantial efforts to assure the accuracy of this data. However, IDES assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.