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IDES
Ablefilm 550K
Epoxy; Epoxide
Supplied by Henkel Ablestik
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Product Description
ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.
General
Material Status
Commercial: Active
Availability
North America
Features
Low (to None) Cadmium Content
Thermally Conductive
Uses
Adhesives
Bonding
Film
Appearance
White
Forms
Pellets
Thermal
Nominal Value
Unit
Glass Transition Temperature (DSC)
°F
CLTE - Flow
< 216°F
in/in/°F
> 216°F
in/in/°F
Thermal Conductivity
(250°F)
Btu·in/hr/ft²/°F
Electrical
Nominal Value
Unit
Volume Resistivity
ohm·cm
Dielectric Strength
V/mil
Dielectric Constant
(1 kHz)
Dissipation Factor
(1 kHz)
Thermoset
Nominal Value
Unit
Shelf Life
(-40°F)
wk
Post Cure Time
257°F
hr
302°F
hr
Additional Information
Nominal Value
Unit
Carrier
Lap Shear
Al to Al: 77°F
psi
Au to Au: 77°F
psi
Weight Loss on Heating
(572°F)
%
Work Life
(77°F)
month
Related Terminology
Product names can be difficult to match. You may have searched any one of these terms to find this product: Ablefilm 550K, Ablefilm , Ablefilm550K, 550 K, 550K, Epoxy; Epoxide, Epoxy Epoxide, Epoxy, Henkel Ablestik, EpoxyEpoxide, K550
Features
Features may also be described by the following terms: Low Cadmium Content.
Notes
1
Typical properties: these are not to be construed as specifications.
Copyright © 2012
IDES
The information presented on this datasheet was acquired by IDES from the producer of the material. IDES makes substantial efforts to assure the accuracy of this data. However, IDES assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.