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HAPWELD 602

Thermoplastic

Supplied by Hapco Inc.

The technical datasheet with complete property values for HAPWELD 602 is available to members of the Prospector Plastics Database.
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Product Description
  • One part, non-shrinking, 100% solids, high temperature performing, structural adhesive, that cures at temperatures as low as 225° F. It is a paste type adhesive, which forms permanent structural bonds between similar and dissimilar materials.
  • Once cured, HAPWELD 602 will operate at temperatures up to 400°F, continuously and should be used in place of HAPWELD 567 in those applications that require temperature performance above 300°F. Cures, as fast as 3 minutes, can be obtained with this system.
  • Supplied as a one-component system, which eliminates all those costly mixing errors, expensive down time, and production rejects.
  • Its creamy, non-sag, consistency allows it to be applied with trowel, knife, brush, or pumping system, and the adhesive will not sag or shrink.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Features 
  • Bondability
  • Fast Cure
  • High Heat Resistance
  • Low Shrinkage
  • Thixotropic
Uses 
  • Adhesives
Appearance 
  • White
Forms 
  • Paste
Physical
Nominal Value
Unit
 
Weight - Per gallon
g
  
Mechanical
Nominal Value
Unit
 
Tensile Strength
psi
  
Shear Strength
      
77°F
psi
  
250°F
psi
  
350°F
psi
  
Thermal
Nominal Value
Unit
 
Service Temperature
°F
  
Electrical
Nominal Value
Unit
 
Volume Resistivity
ohm·cm
  
Dielectric Strength
V/mil
  
Dielectric Constant
 
  
Additional Information
Nominal Value
Unit
 
Bond Strength
mil
  
Cure Time
      
225°F
hr
  
250°F
hr
  
300°F
hr
  
400°F
hr
  
Related Terminology
Product names can be difficult to match. You may have searched any one of these terms to find this product: HAPWELD 602, HAPWELD , HAPWELD602, 602, Thermoplastic, Unspecified, Thermoplastic Unspecified, TP, Unspecified, TP Unspecified, Hapco Inc., ThermoplasticUnspecified, TPUnspecified
Features
Features may also be described by the following terms: Low Shrinkage, High Heat Resistance, Bondability, Bondable, Fast Cure, Fast Curing.
Notes
1Typical properties: these are not to be construed as specifications.
 
IDES
Copyright © 2012 IDES
The information presented on this datasheet was acquired by IDES from the producer of the material. IDES makes substantial efforts to assure the accuracy of this data. However, IDES assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.