Sumikon EME-S325 Sumitomo Bake Epoxy; Epoxide

Product Description
EME-S325 is a low alpha particle epoxy molding compound.
General
Material Status	Commercial: Active
Availability	North America
Features	Moisture Resistant
Uses	Semiconductor Molding Compounds
Forms	Liquid
Processing Method	Encapsulating

Physical	Nominal Value	Unit	Test Method
Specific Gravity			ASTM D792
Water Absorption (24 hr)		%	ASTM D570
Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus (77°F)		psi	ASTM D790
Flexural Strength (77°F)		psi	ASTM D790
Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature		°F	ASTM E1356
Thermal Conductivity		Btu·in/hr/ft²/°F	ASTM C177
Electrical	Nominal Value	Unit	Test Method
Volume Resistivity		ohm·cm	ASTM D257
Thermoset	Nominal Value	Unit	Test Method
Demold Time (347°F)		min
Post Cure Time (347°F)		hr
Additional Information
Spiral Flow, SB-U-03-003: 80 cm Gel Time, SB-U-03-005, 175°C: 30 sec Thermal Expansion, SB-U-02-002, T<Tg: 1.1 E-5/°C Thermal Expansion, SB-U-02-002, T>Tg: 4.3 E-5/°C Flexural Strength, SB-U-01-001, 240°C: 19.6 MPa Flexural Modulus, SB-U-01-002, 240°C: 63.8 MPa UL-94 Flame Class, SB-U-03-003: V-0 Extracted Na+, SB-U-04-043: <1 ppm Extracted Cl-, SB-U-04-043: 5 ppm Transfer Pressure: 687-1177 MPa
Related Terminology
Product names can be difficult to match. You may have searched any one of these terms to find this product: Sumikon® EME-S325, Sumikon EMES325, Sumikon® , Sumikon, SumikonEMES325, EME, EME S 325, EME-S325, EMES325, EME:S325, EME/S325, EME+S325, EME_S325, EME S325, EMES, S325, Epoxy; Epoxide, Epoxy Epoxide, Epoxy, Sumitomo Bake, EpoxyEpoxide, SEME
Features
Features may also be described by the following terms: Moisture Resistant, Water Resistant, Low Moisture Absorption, Low Water Absorption.

Notes

¹Typical properties: these are not to be construed as specifications.

Sumikon® EME-S325