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BCC Resins HPX-850

Epoxy; Epoxide

Supplied by BCC Products Inc.

The technical datasheet with complete property values for BCC Resins HPX-850 is available to members of the Prospector Plastics Database.
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Product Description
HPX-850 is a light weight, heat resistant, two component epoxy backfill system. Like BC 7020, the filler portion is pre-blended into the resin and hardener components for easier handling, thus simplifying the mixing process. HPX-850 features advantages such as low cost, long pot life, machineability, and low shrinkage. It is ideally suited for numerous applications involving mold and core constructions.

HPX-850 can be removed from the mold after allowing to set 24 hours @ room temperature (75°F). Post cure for applications requiring temperatures above 150°F can be accomplished in an oven or in use by a gradual heat rise; 2 hours @ 150°F, plus 2 hours @ 250°F, plus 2 hours at 300°F.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Features 
  • High Heat Resistance
  • Low Shrinkage
  • Machinable
Uses 
  • Molds/Dies/Tools
Appearance 
  • Grey
Forms 
  • Paste
Processing Method 
  • Casting
Physical
Nominal Value
Unit
Test Method
Specific Gravity
      
--
 
 ASTM D792
--
g/cm³
 ASTM D1505
Molding Shrinkage - Flow
in/in
 ASTM D955
Thermal
Nominal Value
Unit
Test Method
Deflection Temperature Under Load (264 psi, Unannealed)
°F
 ASTM D648
Thermoset
Nominal Value
Unit
Test Method
Thermoset Components
      
Hardener
 
  
Resin
 
  
Pot Life (75°F)
min
  
Demold Time
min
  
Related Terminology
Product names can be difficult to match. You may have searched any one of these terms to find this product: BCC Resins HPX-850, BCC Resins HPX850, BCC Resins , BCCResinsHPX850, BCCResins, HPX, ResinsHPX-850, ResinsHPX850, ResinsHPX:850, ResinsHPX/850, ResinsHPX+850, ResinsHPX_850, ResinsHPX 850, ResinsHPX, HPX-850, HPX850, HPX:850, HPX/850, HPX+850, HPX_850, HPX 850, Epoxy; Epoxide, Epoxy Epoxide, Epoxy, BCC Products, EpoxyEpoxide, 850HPX, 850ResinsHPX
Features
Features may also be described by the following terms: High Heat Resistance, Low Shrinkage.
Uses
Uses may also be described by the following terms: Molds/Dies/Tools, Molds, Dies, tools.
Notes
1Typical properties: these are not to be construed as specifications.
 
IDES
Copyright © 2012 IDES
The information presented on this datasheet was acquired by IDES from the producer of the material. IDES makes substantial efforts to assure the accuracy of this data. However, IDES assumes no responsibility for the data values and strongly encourages that upon final material selection, data points are validated with the material supplier.