|
Density
|
|
g/cm³
|
ISO 1183 |
|
Melt Mass-Flow Rate (MFR) (280°C/5.0 kg)
|
|
g/10 min
|
ISO 1133 |
|
Melt Volume-Flow Rate (MVR) (280°C/5.0 kg)
|
|
in³/10min
|
ISO 1133 |
|
Molding Shrinkage
|
|
|
ISO 294-4 |
|
Across Flow
|
|
%
|
|
|
Flow
|
|
%
|
|
|
Tensile Modulus
|
|
psi
|
ISO 527-2 |
|
Tensile Stress (Yield)
|
|
psi
|
ISO 527-2 |
|
Tensile Strain (Yield)
|
|
%
|
ISO 527-2 |
|
Nominal Tensile Strain at Break
|
|
%
|
ISO 527-2 |
|
Flexural Modulus
|
|
psi
|
ISO 178 |
|
Flexural Strength
|
|
psi
|
ISO 178 |
|
Charpy Notched Impact Strength (73°F)
|
|
ft·lb/in²
|
ISO 179 |
|
Charpy Unnotched Impact Strength (73°F)
|
|
|
ISO 179 |
|
Heat Deflection Temperature
|
|
|
|
|
66 psi, Unannealed
|
|
°F
|
ISO 75-2/B |
|
264 psi, Unannealed
|
|
°F
|
ISO 75-2/A |
|
CLTE - Flow
|
|
in/in/°F
|
ISO 11359-2 |
|
Surface Resistivity
|
|
ohms
|
IEC 60093 |
|
Volume Resistivity
|
|
ohm·cm
|
IEC 60093 |
|
Relative Permittivity
|
|
|
IEC 60250 |
|
100 Hz
|
|
|
|
|
1 MHz
|
|
|
|
|
Dissipation Factor
|
|
|
IEC 60250 |
|
100 Hz
|
|
|
|
|
1 MHz
|
|
|
|
|
Comparative Tracking Index
|
|
V
|
IEC 60112 |
|
Electric Strength
|
|
|
IEC 60243-1 |
|
0.0394 in
|
|
V/mil
|
|
|
0.118 in
|
|
V/mil
|
|
|
Electric Strength, IES 60243-1: >65 kV/mm
Molding Shrinkage, ISO 294-4, 3.2 mm, Flow: 1.0 to 1.2%
Molding Shrinkage, ISO 294-4, 3.2 mm, Across Flow: 1.1 to 1.3%
|
|
Product names can be difficult to match. You may have searched any one of these terms to find this product: LEMALLOY® PX603, LEMALLOY PX603, LEMALLOY® , LEMALLOY, LEMALLOYPX603, PX 603, PX603, Polyphenylene Ether, PPE, Mitsubishi EP, PolyphenyleneEther, 603PX
|
|
Features may also be described by the following terms: High Flow, High Melt, High MFI.
|