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Specific Gravity
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ASTM D792 |
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Melt Mass-Flow Rate (MFR) (275°C/2.16 kg)
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g/10 min
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ASTM D1238 |
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Molding Shrinkage - Flow (0.118 in)
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in/in
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ASTM D955 |
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Tensile Strength (Yield, 73°F)
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psi
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ASTM D638 |
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Tensile Elongation (Break, 73°F)
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%
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ASTM D638 |
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Flexural Modulus (73°F)
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psi
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ASTM D790 |
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Flexural Strength (73°F)
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psi
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ASTM D790 |
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Notched Izod Impact (73°F)
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ft·lb/in
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ASTM D256 |
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Rockwell Hardness (R-Scale)
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ASTM D785 |
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Deflection Temperature Under Load
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ASTM D648 |
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66 psi, Unannealed
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°F
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264 psi, Unannealed
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°F
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Melting Temperature
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°F
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DSC |
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Flame Rating - UL (0.0315 in)
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UL 94 |
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Product names can be difficult to match. You may have searched any one of these terms to find this product: Kepamid® 2300MRH, Kepamid 2300MRH, Kepamid® , Kepamid, Kepamid2300MRH, 2300 MRH, 2300MRH, Polyamide 66, Nylon 66, Polyamide, Nylon, pa66, Korea Eng, Polyamide66, Nylon66, MRH2300
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Generic Name may also be described by the following terms: PA66.
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Features may also be described by the following terms: High Heat Resistance, Heat Stabilized, Heat-ageing Stabilized, Heat Ageing Stabilized, Heat-aging Stabilized, Heat Aging Stabilized, Good Heat Aging Resistance.
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Uses may also be described by the following terms: Electrical Applications, Electronic Applications, Electrical/Electronic Applications, Electrical Sector, Automotive Applications, Automotive Sector.
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