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Conductivity, Vendor, Through Plane (Z-direction): 50 S/cm
Conductivity, Vendor, In Plane (X,Y direction): 100 S/cm
Instrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Total Energy: 2.63 ft-lb
Instrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Energy to Max Load: 0.55 ft-lb
Compressive Creep, ASTM D2990, 200 psi, 200 hr @ 80°C: 0.025%
Compressive Creep, ASTM D2990, 200 psi, 1000 hr @ 80°C: 0.040%
DMA-Modulus, ASTM D4065, 25°C: 2.0x10^6
DMA-Modulus, ASTM D4065, 100°C: 1.6x10^6
DMA-Modulus, ASTM D4065, 150°C: 1.23x10^6
DMA-Modulus, ASTM D4065, 175°C: 0.94x10^6
DMA-Modulus, ASTM D4065, 200°C: 0.50x10^6
Thermal Expansion, E831: 30 micro m/m°C
Thermal Conductivity, E1461-92, In-Plane, 25°C: 46.2 W/m-K
Thermal Conductivity, E1461-92, In-Plane, 85°C: 43.7 W/m-K
Thermal Conductivity, E1461-92, Through-Plane, 25°C: 19.2 W/m-K
Thermal Conductivity, E1461-92, Through-Plane, 85°C: 18.5 W/m-K
Diffusivity, E1461-92, In-Plane, 25°C: 0.302 cm^2/s
Diffusivity, E1461-92, In-Plane, 85°C: 0.231 cm^2/s
Diffusivity, E1461-92, Through-Plane, 25°C: 0.125 cm^2/s
Diffusivity, E1461-92, Through-Plane, 85°C: 0.098 cm^2/s
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