Plastication: 50rpm
Injection Pressure: Set to give 3 to 5 seconds injection time
Hold Pressure: 50 to 100% of injection pressure
Hold Time: 10 sec minimum
Cure Time, 0.125 in: 30 to 35 sec
The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.
The value listed as Molding Shrinkage, ISO 294-4, was tested in accordance with ISO 2577 using compression molded specimens.
Water Absorption, ASTM D570, 48 hrs, 50°C: 0.15%
Flexural Strain, ASTM D790: 0.62%
DTUL @264psi - Unannealed, ASTM D648, Post Baked: 550°F
Dielectric Strength, ASTM D149, 60 Hz, Method A, dry: 330 V/mil
Dielectric Strength, ASTM D149, 60 Hz, Method B, dry: 285 V/mil
Compressive Strength, ISO 604: 245 MPa
Dielectric Strength, IEC 243, Method A, wet: 13 V/mil
Compression and Transfer Molding Conditions:
- Preforming Pressure: 8000 to 12000 psi
- Preheat Temperature: 210 to 235 °F
- Mold Temperature: 330 to 360 °F
- Compression Mold Pressure: 2500 to 5000 psi
- Transfer Mold Pressure: 4000 to 6000 psi
- Cure Time, 0.125 in: 40 to 50 sec