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  Home > Generics > PI Home
 Polyimide (PI) Processing Information
English
Properties
API
PAI
PI, TP
Specific Gravity1.04 to 1.171.34 to 1.591.31 to 1.38
Mold Shrinkage, Flow (in/in)--0.0014 to 0.00730.0089 to 0.011
Melt Mass Flow Rate (g/10 min)----0.0 to 12
Drying Temperature (°F)--350347 to 348
Drying Time (hr)--3.05.0 to 5.1
Suggested Max Moisture (%)--0.0500.020
Suggested Max Regrind (%)------
Injection Pressure (psi)----23800 to 24000
Rear Temperature (°F)--580698 to 725
Middle Temperature (°F)----721 to 748
Front Temperature (°F)----738 to 761
Nozzle Temperature (°F)--700730 to 761
Processing (Melt) Temp (°F)----739 to 766
Mold Temperature (°F)--405325 to 326

SI
Properties
API
PAI
PI, TP
Specific Gravity (g/cm³)1.04 to 1.171.34 to 1.591.31 to 1.37
Mold Shrinkage, Flow (cm/cm)--0.0014 to 0.00730.0089 to 0.011
Melt Mass Flow Rate (g/10 min)----0.0 to 12
Drying Temperature (°C)--177175
Drying Time (hr)--3.05.0 to 5.1
Suggested Max Moisture (%)--0.0500.020
Suggested Max Regrind (%)------
Injection Pressure (MPa)----164 to 165
Rear Temperature (°C)--304370 to 385
Middle Temperature (°C)----383 to 398
Front Temperature (°C)----392 to 405
Nozzle Temperature (°C)--371388 to 405
Processing (Melt) Temp (°C)----393 to 408
Mold Temperature (°C)--207163 to 164

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